With two photon spectroscopy

With soft litography

With photolithography

With 3D printing

Plasma treatment creates a temporary electrostatic charge that repels dust particles only within the first 30 seconds

Delaying bonding leads to an increase in Young's modulus, which prevents proper fluid flow.

The surface reverts from hydrophilic to hydrophobic over time, reducing the bond strength.

Unbonded surfaces begin to outgas toxic byproducts into the PDMS channels after exposure to air.

Because it requires specific temperature and humidity for the fabrication

Because it prevents the accumulation of dust and particles in the patterns

Because it is a sterile environment needed for an organ-on-chip

All the answers are correct

   Its transparency to UV and visible light

Its soft and flexible nature

Its permeability to oxygen

  All answers are correct

         1. Master mold

2. PDMS pouring and reticulation

3. Inlet drilling

4. Release PDMS replica

5. Plasma treatment

6. Put in contact for bonding

          1. Master mold

2. PDMS pouring and reticulation

3. Release PDMS replica

4. Put in contact for bonding

5. Plasma treatment

6. Inlet drilling

         1. Master mold

2. PDMS pouring and reticulation

3. Release PDMS replica

4. Inlet drilling

5. Put in contact for bonding

6. Plasma treatment

         1. Master mold

2. PDMS pouring and reticulation

3. Release PDMS replica

4. Inlet drilling

5. Plasma treatment

6. Put in contact for bonding

Sterilize the chip parts before use

Oxidize the chip parts to bond them

Clean the chip parts before use

Facilitate the introduction of oxygen into the chip

No, the bubbles are positive to introduce oxygen into the system

Yes, because bubbles can render a wrong transfer in the microchannel pattern

Yes, the bubbles could change the crosslinking of the PDMS

No, the bubbles do not affect the microchannels

85ºC

65ºC

Room temperature

All answers are correct

10:1

25:2

20:1

10:5