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Why is it critical to bond the PDMS chip to the glass substrate immediately after oxygen plasma treatment?
Plasma treatment creates a temporary electrostatic charge that repels dust particles only within the first 30 seconds
Delaying bonding leads to an increase in Young's modulus, which prevents proper fluid flow.
The surface reverts from hydrophilic to hydrophobic over time, reducing the bond strength.
Unbonded surfaces begin to outgas toxic byproducts into the PDMS channels after exposure to air.
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